Joseph Bousaba named CEO of InvenSense & GM of TDK MEMS Sensors Business Group 18+ years in semiconductor leadership - Philips, Qualcomm, TDK InvenSense: inventor of the 6-axis IMU 750 employees - San Jose, California headquarters MEMS sensors for mobile, wearables, automotive, industrial & robotics Joseph Bousaba named CEO of InvenSense & GM of TDK MEMS Sensors Business Group 18+ years in semiconductor leadership - Philips, Qualcomm, TDK InvenSense: inventor of the 6-axis IMU 750 employees - San Jose, California headquarters MEMS sensors for mobile, wearables, automotive, industrial & robotics
PROFILE Joseph Bousaba steps up as CEO of TDK InvenSense - October 2024
Joseph Bousaba, CEO of TDK InvenSense
CEO & GM · TDK InvenSense · San Jose, CA

Joseph
Bousaba

President & CEO, TDK InvenSense — GM, TDK MEMS Sensors Business Group

The company that invented the 6-axis IMU - the chip telling your phone which way is up - now has a new CEO. Joseph Bousaba arrived at InvenSense in 2019 as Chief Business Officer, quietly rebuilt its business unit structure, and in October 2024 took the top seat. He has been building sensor businesses since before "edge AI" was a phrase anyone used.

MEMS Semiconductors Edge AI IoT Sensor Fusion Automotive
18+
Years in Semiconductors
750
Employees at InvenSense
$340M
Annual Revenue
2003
InvenSense Founded

Sensing Everything, Everywhere

There are sensors in the device you are reading this on. There is a good chance those sensors have something to do with InvenSense. Joseph Bousaba now runs that company - and the broader TDK Corporation MEMS Sensors Business Group that sits behind it.

His appointment as CEO came on October 1, 2024, in a transition that was quiet by Silicon Valley standards. No drama, no sudden departure - predecessor Omar Abed stepped back for personal reasons, with both executives coordinating the handover to keep the business continuous. Bousaba was already in the building. He had been InvenSense's Chief Business Officer, then General Manager of multiple business units, then President of TDK Chirp Microsystems. The CEO title was a logical next line in a career that has always moved toward larger and more complex things.

Before InvenSense, Bousaba spent five years at Qualcomm as Vice President of Consumer IoT and Smart Home. The phrase "multi-hundred-million-dollar business" appears repeatedly in descriptions of that chapter - and he built it from the early, uncertain days of connected devices, before mass adoption made the category look obvious. He arrived at Qualcomm through Qualcomm Atheros, where he led the Emerging Business unit and planted early flags in automotive wireless and IoT connectivity.

Before that, Philips Semiconductors - now NXP - was where he started, working through engineering and business leadership roles in cellular RF and wireless. The pattern has been consistent: find the sector just before it becomes essential, build the business, hand it to the next phase, move to the harder problem.

"We have the best MEMS sensor team and partnerships in the world, and I'm honored to lead us toward ongoing innovation and growth."
Joseph Bousaba - October 2024, upon being named CEO of InvenSense

InvenSense: The Company Inside Every Pocket

InvenSense was founded in 2003 in San Jose, California, and it has one claim that no one else can make: it invented the 6-axis IMU - the inertial measurement unit combining gyroscope and accelerometer data that allows devices to track orientation and motion in three dimensions. That invention is now embedded in billions of consumer devices. It tells your phone whether you are holding it in portrait or landscape. It stabilizes the camera when your hand shakes. It helps drones maintain altitude. It makes the tracking in mixed-reality headsets feel real.

TDK Corporation acquired InvenSense and has since built it into a broader MEMS sensing platform. Under Bousaba, InvenSense makes sensors across five categories: Motion, Sound (microphones), Pressure, Gas, and Ultrasonic. The markets it serves span Consumer, Mobile, IoT, Smart Home, Industrial, Automotive, and Robotics. The range is not diversification for its own sake - it reflects a thesis that sensing capability is becoming foundational infrastructure, not a product category.

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Mobile
Wearables
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Industrial
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Automotive
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Robotics
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Smart Home

Why Tiny Chips Are Becoming a Very Big Deal

MEMS - micro-electro-mechanical systems - are chips that combine mechanical components with electronics at a microscopic scale. They measure the physical world: acceleration, rotation, sound, pressure, proximity, and more. The engineering challenge is extraordinary. InvenSense's gyroscopes, for instance, can detect rotational rates with precision typically reserved for laboratory instruments, housed in a chip smaller than a grain of rice.

Bousaba has spent his career in wireless connectivity and IoT - domains that are entirely dependent on sensing quality. The sensor is where the physical world becomes data. Everything downstream - the algorithms, the models, the applications - is only as good as what the sensor captures. As edge AI matures, that dependency intensifies. Processing that once happened in the cloud is moving to the device itself, which means the sensor and the processing chip need to work in tighter harmony than ever before.

InvenSense's push into sensor fusion algorithms - combining data from multiple sensor types to produce richer, more reliable outputs - is central to Bousaba's strategic direction. A standalone gyroscope tells you rotation. A gyroscope paired with an accelerometer, processed by good fusion software, tells you exactly where you are and how fast you are moving. Paired with a microphone and pressure sensor, it can tell you whether you are in a car, in a stairwell, or in a shopping mall.

That capability is what makes InvenSense relevant not just to smartphone manufacturers, but to automotive OEMs building ADAS systems, industrial engineers building predictive maintenance platforms, and robotics teams building machines that need to navigate the physical world with confidence.

"I'm committed to the partner-first values and strategic vision on which Omar and I have aligned in building the resilient business we have today."
Joseph Bousaba - on his leadership philosophy at InvenSense

From Engineer to CEO in 18 Years

Bousaba holds two electrical engineering degrees from the University of North Carolina at Charlotte - both a B.S. and an M.S. He started as an engineer, not as a business school product. That technical grounding is visible in how he talks about InvenSense's work: the emphasis on precision, reliability, and integration, rather than headline product launches or marketing pivots.

The tailored MBA he completed at Ashridge College in the UK - designed specifically for Philips Semiconductors executives - gave him the business toolkit. But the progression from engineer to CEO at a company of this technical depth has always required both sides of that equation.

At Qualcomm Atheros he was building from zero - launching IoT and automotive wireless connectivity initiatives before the categories had their current shape. At Qualcomm proper, running Consumer IoT and Smart Home, the scale expanded into the hundreds of millions. He arrived at InvenSense in November 2019, absorbed the company's structure, took on the Chief Business Officer role, and then - over five years - moved through General Manager positions in Motion, Pressure, and Emerging Sensors before becoming President of TDK Chirp Microsystems. When the CEO role opened in October 2024, the promotion was less a disruption than a continuation.

The Path to the Top

Early Career
Philips Semiconductors / NXP - Engineering and business leadership in cellular RF and wireless connectivity
2012
Qualcomm Atheros - Led Emerging Business unit; built IoT and automotive wireless connectivity initiatives from the ground up
2014
Qualcomm VP, Consumer IoT & Smart Home - Built and managed a multi-hundred-million-dollar business across Home Entertainment, Smart Cameras, Imaging, and Printers
Nov 2019
Joins TDK InvenSense as Chief Business Officer, overseeing all business units
2019-2024
Multiple GM Roles - GM & VP of Motion & Pressure BU; GM & VP of Emerging Sensors BU; President of TDK Chirp Microsystems
Oct 2024
Appointed CEO of InvenSense and General Manager of TDK Corporation's MEMS Sensors Business Group - the top of the house

Where InvenSense Is Headed

Under Bousaba, InvenSense is positioned at several intersecting wave fronts. Edge AI is the most talked about - the shift toward on-device processing that makes sensors not just data collectors but inference endpoints. InvenSense's sensor fusion algorithms, which combine inputs from multiple sensor types into actionable intelligence, are a natural fit for this model. A device that can classify motion, detect sound events, and measure pressure changes - locally, without a cloud round-trip - is a fundamentally different product than one that just streams raw data.

Automotive is the other major vector. Advanced driver assistance systems (ADAS) and autonomous vehicle platforms need inertial measurement with extreme precision and reliability. InvenSense's automotive-grade sensors - designed to operate through high shock, vibration, and temperature ranges - put it in the supply chain of some of the world's largest automotive OEMs.

Robotics and industrial automation close the picture. As robot fleets expand in warehouses, manufacturing facilities, and logistics operations, the demand for reliable, compact, low-power sensing grows with them. InvenSense's miniaturization capabilities - fitting high-performance sensors into extraordinarily small form factors - make it a natural partner for the next generation of intelligent machines.

The keyword list associated with InvenSense runs to hundreds of terms: ultrasonic ToF sensors, optical image stabilization gyroscopes, high-shock MEMS sensors, wearable motion sensors, proximity sensors, environmental sensors. The breadth is not accidental. Bousaba is building - or continuing to build - a platform for the physical layer of the digital world.

Academic Foundation

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M.S. in Electrical Engineering
University of North Carolina at Charlotte
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B.S. in Electrical Engineering
University of North Carolina at Charlotte
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Tailored MBA for Philips Semiconductors
Ashridge College, United Kingdom
MEMSIMUGyroscopesAccelerometersSensor FusionEdge AIIoTAutomotive ADASMotion SensingMEMS MicrophonesUltrasonic ToFPressure SensorsWearablesRoboticsIndustrial AutomationSmart HomeOptical Image StabilizationLow PowerMiniaturizationConsumer Electronics

The Details That Matter

01
InvenSense invented the 6-axis IMU - the chip that tells your phone which way is up and stabilizes your camera in a shaky hand. Bousaba now runs that company.
02
His MBA was not off-the-shelf. Philips Semiconductors commissioned a tailored executive program at Ashridge College in the UK, designed specifically for their leadership pipeline.
03
Bousaba holds both a B.S. and M.S. in Electrical Engineering from UNC Charlotte - the technical foundation that anchors his operator instincts in physical reality.
04
He lives in Pleasanton, California - a Bay Area suburb 30 miles east of San Jose, where InvenSense's headquarters sits at 1745 Technology Drive.
05
Before edge AI was a category, Bousaba was already building IoT business units at Qualcomm - learning early that the device layer is where everything starts, not where it ends.
06
InvenSense's sensor catalog spans five types - Motion, Sound, Pressure, Gas, Ultrasonic - serving markets from consumer electronics to autonomous vehicles to industrial robotics.