mixed-signal
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eTopus Technology
eTopus Technology is a San Jose-based semiconductor IP company that designs ultra-high-speed, ADC/DSP-based SerDes and die-to-die interconnect IP for data centers, high-performance computing, AI, 5G and storage. Founded in 2012 by Harry Chan and Peter Kou, the company licenses silicon-proven PHY IP - spanning 112G on advanced 6/7nm nodes down to 22nm - plus chiplet interfaces supporting UCIe, Bunch of Wires, PCIe Gen 5/6 and CXL. eTopus positions itself on low latency and low power, and has built collaborative chiplet platforms with partners including QuickLogic, OpenFive and CoMira.
Celera Corporation
Celera is an Alameda-based analog semiconductor company using AI to automate the historically artisanal craft of analog IC design. Its ChipHUB platform combines proprietary machine-learning agents with decades of analog expertise to deliver custom analog and mixed-signal chips up to 10x faster than legacy vendors. In March 2025, Celera became the first company to sample an analog IC entirely designed by autonomous software.
Otto Marroquin
Otto Marroquin is the Founder of Celera Corporation (operating as Celera Incorporated / Celera Semiconductor), an AI-powered analog semiconductor company headquartered in Alameda, California. Celera has built a patented platform - Nestos - that uses digital twins and behavioral modeling to automate analog IC design, cutting development cycles by up to 10x compared to traditional workflows. Backed by $23 million in funding including a $20 million Series A from Maverick Silicon in August 2025, Marroquin's venture targets the $70 billion analog semiconductor market with a platform that delivers custom analog ICs at a pace the industry has never seen before.
Omni Design Technologies, Inc.
Omni Design Technologies builds high-performance, ultra-low-power semiconductor IP - the data converters and mixed-signal blocks that move information between the analog and digital worlds. Its Swift family of ADCs, DACs and analog front-ends sits inside SoCs for AI infrastructure, 5G/6G, Wi-Fi 7, automotive lidar/radar, satellite links, and quantum control, fabricated on processes from 28nm down to advanced FinFET nodes.