bill-of-materials
(4)
BaseFrame
BaseFrame is a San Francisco AI startup from Y Combinator's Winter 2026 batch, founded by UC Berkeley classmates Anshul Paul and Vaibhav Agrawal. The company has iterated quickly across the AI stack - launching first as an AI copilot that catches hardware design flaws before boards are built, then as a desktop app that scans a team's own work history to find what AI can automate, and most recently pivoting to Clam, a 'Semantic Firewall' that adds enterprise-grade security around broad-access AI agents. Across all three, the thread is the same: make powerful AI safe, useful, and grounded in real work.
Rebar
Rebar is a New York-based vertical AI company building hyper-specialized estimating software for commercial HVAC equipment suppliers. Its proprietary computer vision models read construction blueprints and spec books, identify and count HVAC equipment, and generate a bill of materials and quote - cutting takeoff time by roughly 60-70%. Founded in October 2024 by Evan Brown and Andrew Schwartz, Rebar raised a $14M Series A led by Prudence in March 2026 and plans to expand into plumbing and electrical.
Bild
Bild is a San Francisco cloud PDM/PLM platform that moves hardware design collaboration off email, spreadsheets, and shared drives and into the browser. Founded in 2021 by ex-Apple engineering program manager Pradyut Paul, it gives mechanical and hardware teams version control, check-in/check-out, bill-of-materials, change orders, and secure supplier sharing across multiple CAD formats, plus an AI suite for diffing and searching designs.
Enzzo
Enzzo is a Seattle-based AI platform that helps hardware product teams move from idea to investment-ready in roughly half the time. Spun out of startup studio Pioneer Square Labs and led by serial founder Ford Davidson, Enzzo uses generative AI and customer-supplied data to draft product definitions, requirements, user personas, competitive analysis, risk assessments, concept images, and bill-of-materials pricing - the slow, document-heavy front end of building physical products. It raised a $3M seed round in March 2024 and counts electronics and instrumentation makers among its early paying customers.