microelectronics
(3)
SEMI
For 55 years SEMI has been the connective tissue of the chip industry - the neutral ground where rival equipment makers, materials suppliers and fabs agree on the rules, sizes and safety norms that let a wafer built in one country be tested in another.
ForwardEdge ASIC
ForwardEdge ASIC is a Saint Paul, Minnesota-based integrated circuit design house and wholly owned subsidiary of Lockheed Martin. It designs 100% domestically traceable custom ASICs and FPGAs - plus silicon IP and turnkey products - for defense, aerospace, space, cybersecurity, and commercial customers. Built by a team of veteran engineers who have worked together for more than 30 years, the company pairs startup speed with Fortune 100 stability and holds DMEA Trusted IC vendor status, positioning it as a secure onshore alternative for mission-critical microelectronics.
3D Glass Solutions, Inc.
3D Glass Solutions (3DGS) is an Albuquerque, New Mexico advanced-packaging company that turns its patented photosensitive APEX glass-ceramic into precise 3D microstructures for chips. Its wafer-level glass substrates, interposers and integrated passive devices serve RF, photonics, high-performance computing and defense customers who need low-loss, high-frequency, thermally stable packaging. Spun out of technology developed at Sandia National Laboratories and led by semiconductor veteran Babu Mandava, the ISO 9001 / AS9100 certified foundry has raised more than $54 million, counts Intel Capital, Applied Ventures and Lockheed Martin Ventures among its backers, and is a partner in DARPA's Next-Generation Microelectronics Manufacturing (NGMM) program for U.S.-based 3D heterogeneous integration.