Syenta

Syenta is an Australian deep-tech semiconductor company building next-generation chip-to-chip interconnects for the AI era. Spun out of the Australian National University, it has developed a proprietary process called Localized Electrochemical Manufacturing (LEM) that deposits and patterns metal in a single step, producing micron-scale interconnects across large packages with fewer process steps. The technology targets the 'memory wall' that limits AI and high-performance computing, aiming to raise interconnect density and bandwidth while cutting manufacturing cost and waste. Headquartered in Sydney with a new development facility in Tempe, Arizona, Syenta has raised more than A$37 million, with former Intel CEO Pat Gelsinger joining its board.