chip-packaging
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Syenta
Syenta is an Australian deep-tech semiconductor company building next-generation chip-to-chip interconnects for the AI era. Spun out of the Australian National University, it has developed a proprietary process called Localized Electrochemical Manufacturing (LEM) that deposits and patterns metal in a single step, producing micron-scale interconnects across large packages with fewer process steps. The technology targets the 'memory wall' that limits AI and high-performance computing, aiming to raise interconnect density and bandwidth while cutting manufacturing cost and waste. Headquartered in Sydney with a new development facility in Tempe, Arizona, Syenta has raised more than A$37 million, with former Intel CEO Pat Gelsinger joining its board.
Vinci
Vinci (Vinci4D, Inc.) is a Palo Alto physics-AI startup building a foundation model that simulates how hardware will behave before it is manufactured. Its system runs full manufacturing-resolution physics - thermal, thermo-mechanical and warpage analysis for advanced semiconductor packaging and 2.5D/3D chips - up to 1,000x faster than traditional finite-element tools, without meshing and without training on customer data. Founded in 2023 by Dr. Hardik Kabaria and Dr. Sarah Osentoski, the company emerged from stealth in December 2025 with $46M in total funding and has been benchmarked by over half of the world's top 20 semiconductor companies.