3d-ic
(2)
Global Unichip Corporation (GUC)
The Taiwanese design house that quietly builds other people's AI chips - and reserved 60,000 CoWoS wafers to keep doing it.
Vinci
Vinci (Vinci4D, Inc.) is a Palo Alto physics-AI startup building a foundation model that simulates how hardware will behave before it is manufactured. Its system runs full manufacturing-resolution physics - thermal, thermo-mechanical and warpage analysis for advanced semiconductor packaging and 2.5D/3D chips - up to 1,000x faster than traditional finite-element tools, without meshing and without training on customer data. Founded in 2023 by Dr. Hardik Kabaria and Dr. Sarah Osentoski, the company emerged from stealth in December 2025 with $46M in total funding and has been benchmarked by over half of the world's top 20 semiconductor companies.