rf-components
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Babu Mandava Has Spent Four Decades Solving the Layer Beneath the Next One
From a first engineering post in India to WiMAX, LTE and glass-core packaging, Mandava's career follows a recurring question: what has to work underneath before the next computing market can scale?
3D Glass Solutions, Inc.
3D Glass Solutions (3DGS) is an Albuquerque, New Mexico advanced-packaging company that turns its patented photosensitive APEX glass-ceramic into precise 3D microstructures for chips. Its wafer-level glass substrates, interposers and integrated passive devices serve RF, photonics, high-performance computing and defense customers who need low-loss, high-frequency, thermally stable packaging. Spun out of technology developed at Sandia National Laboratories and led by semiconductor veteran Babu Mandava, the ISO 9001 / AS9100 certified foundry has raised more than $54 million, counts Intel Capital, Applied Ventures and Lockheed Martin Ventures among its backers, and is a partner in DARPA's Next-Generation Microelectronics Manufacturing (NGMM) program for U.S.-based 3D heterogeneous integration.