chip-to-chip
(2)
Syenta
Syenta is an Australian deep-tech semiconductor company building next-generation chip-to-chip interconnects for the AI era. Spun out of the Australian National University, it has developed a proprietary process called Localized Electrochemical Manufacturing (LEM) that deposits and patterns metal in a single step, producing micron-scale interconnects across large packages with fewer process steps. The technology targets the 'memory wall' that limits AI and high-performance computing, aiming to raise interconnect density and bandwidth while cutting manufacturing cost and waste. Headquartered in Sydney with a new development facility in Tempe, Arizona, Syenta has raised more than A$37 million, with former Intel CEO Pat Gelsinger joining its board.
AttoTude
AttoTude is a Menlo Park, California deep-tech startup building the world's first THz (terahertz) radio over wire - an interconnect platform that moves data between AI servers and GPUs at hundreds of gigabits per second over standard wire, without photonics or exotic packaging. Founded in 2024 by optical-networking veteran Dave Welch and RF/semiconductor pioneer Joy Laskar, the company adapts fiber-grade signaling to terahertz frequencies on low-cost ASICs to break the bandwidth, power, and reliability bottlenecks choking AI data centers. It came out of stealth at OFC 2025 and has raised roughly $91M total, including a $50M Series B led by Mayfield.