Crystal Sonic is a Phoenix, Arizona deep-tech startup that uses sound to cut semiconductor costs. Its patented Sonic Lift-off (SLO) technology acts as an 'acoustic scalpel,' peeling thin device layers off expensive wafers so the underlying substrate can be reused instead of ground into dust. Legacy manufacturing wastes 90% or more of substrate material, and substrates can account for up to half of a device's cost - Crystal Sonic wants to reclaim that. Spun out of an Arizona State University lab in 2018, the company has won backing from NASA, the Department of Energy, the NSF, and Lam Capital.
Arno Merkle is the co-founder and CEO of Crystal Sonic, a Phoenix deep tech startup whose patented Sonic Lift-Off technology uses sound waves as an 'acoustic scalpel' to split thin device layers off semiconductor wafers so the costly substrate can be reused. A materials scientist with a Ph.D. from Northwestern and more than 75 technical papers to his name, Merkle spent two decades building and exiting X-ray and electron microscopy companies (Xradia, acquired by Carl Zeiss in 2013; XRE, acquired by Tescan in 2018) before turning his attention to one of chipmaking's quietest scandals: that conventional wafering throws away 90% or more of pristine, expensive crystal. With Crystal Sonic he is trying to make next-generation chips cheaper and far less wasteful, one sound wave at a time.