The fabless design house building the silicon IP behind AI - and the maker of Malaysia's largest IPO in 16 years.
SkyeChip designs the parts of a chip that never appear on a spec sheet but decide whether it works. The Penang-based company builds silicon intellectual property - the reusable memory interfaces, interconnects and processor cores that other companies license and drop into their own designs - and it develops custom application-specific integrated circuits (ASICs) on advanced 6nm and 7nm process nodes. It does not own a fab. That is the point.
By sitting in the design layer rather than the manufacturing layer, SkyeChip occupies the high-margin, knowledge-intensive corner of the semiconductor value chain. A single well-designed IP block - say, a memory PHY and controller - can be licensed to many customers, turning engineering hours into recurring revenue. That model is why a company founded in 2019 reported a roughly 30% net-profit margin in FY2025.
The focus is deliberate: artificial intelligence and high-performance computing. AI accelerators are starved for memory bandwidth, and SkyeChip's fastest-growing product line - memory-interface IP for High Bandwidth Memory and LPDDR - sits exactly where that demand lands. Revenue from that line grew about 530% between FY2023 and FY2025.
The company frames its purpose plainly: "We Innovate to Accelerate AI and High Performance Computing." In practice that means shipping IP for HBM3E, DDR5, LPDDR5x, UCIe chiplet interconnect, network-on-chip fabrics and RISC-V CPU cores - the plumbing of a modern AI datacenter.
"SkyeChip designs silicon intellectual property and custom ASICs rather than manufacturing chips - positioning it in the high-margin, knowledge-intensive segment of the semiconductor value chain."- Techwire Asia, on SkyeChip's IPO
PHY and controller IP for HBM3/HBM3E (up to 9600 MT/s), DDR5/DDR4 and LPDDR5/5x - the company's standout, fastest-growing product line for AI bandwidth.
UCIe 2.0-compliant chiplet interconnect PHY and controller for high-bandwidth, low-power multi-die and heterogeneous integration.
System-optimised NoC fabric IP for complex SoC and multi-die architectures.
Programmable and processor IP including RISC-V CPU cores and high-speed PLLs, with a roadmap toward Arm-based CPU platforms.
Turnkey custom ASIC development on 6nm/7nm nodes - architecture, RTL, physical design and silicon validation.
New product introduction, test and product engineering, and high-volume-manufacturing enablement via global foundry collaboration.
*FY2023 figure approximated from reported 44.6% CAGR. FY2025 net profit RM35.9m (~30.1% margin). Listing entered debt-free with RM57.6m cash.
SkyeChip's customers are chip and system companies building AI, HPC and data-centre silicon. Revenue is heavily weighted toward Greater China - a strength today and the concentration risk management is working to diversify. The top five clients accounted for roughly 72% of FY2025 revenue.
The global silicon-IP market is dominated by a handful of giants - Synopsys, Cadence, Rambus, Alphawave Semi - selling memory, interconnect and ASIC IP. SkyeChip differentiates as a Southeast Asian front-end design house offering system-optimised, cost-competitive IP, backed by engineers who ran billion-dollar divisions at Intel, Altera and Broadcom.
Its edge is depth of talent relative to size: 365 IC designers and 113 filed patents concentrated on the memory and interconnect problems AI cares about most. Where larger vendors spread across dozens of categories, SkyeChip goes deep on bandwidth - HBM3E, LPDDR5x, UCIe - the exact bottlenecks of AI compute.
The market context matters too. Malaysia has been the world's semiconductor back-end for decades - packaging, assembly and test. SkyeChip is the bet that the country can move up the stack into front-end design. It is recognised as Malaysia's first homegrown AI chip designer and a flagship of the National Semiconductor Strategy and NIMP 2030.
That national alignment brought tangible support: SkyeChip is one of three Malaysian firms with Arm Flexible Access under a RM1.1 billion government-backed partnership, and its IPO drew cornerstone backing from EPF, Khazanah Nasional and AIA.
Over 30 years in semiconductors, more than 20 of them at Intel, where he helped grow Malaysia's design centre to about 1,500 people. Later VP of R&D at Altera and a senior director at Broadcom overseeing a US$1 billion division. BSEE from Universiti Teknologi Malaysia; EMBA from Washington University in St. Louis.
Over 20 years in semiconductors, including 12 at Intel on microprocessor and chipset development, then Principal Engineer and Chief Architect for FPGA products at Altera/Intel. Expertise in memory hierarchy, 3D interconnects and high-speed protocols. First-class BSEE from Universiti Sains Malaysia.
"We Innovate to Accelerate AI and High Performance Computing."- SkyeChip company mission
Veteran engineers from Intel, Altera and Broadcom establish SkyeChip Berhad to do front-end IC and silicon IP design in Malaysia.
The company builds out memory-interface IP, ASIC design services and NPI/HVM engineering on advanced 6nm/7nm nodes.
Expansion into UCIe die-to-die interconnect, network-on-chip fabrics and RISC-V processor IP.
Memory-interface IP revenue surges on AI demand; SkyeChip is selected for Arm Flexible Access under a government-backed programme.
Lists on 20 May 2026, raising RM352m at 95x oversubscription - the largest Malaysian IPO in 16 years - and announces expansion into AI silicon products.
SkyeChip is a fabless semiconductor company that designs silicon intellectual property (IP) and custom ASICs for AI and high-performance computing - specialising in memory-interface IP, UCIe chiplet interconnect, network-on-chip fabrics and processor IP. It licenses IP and provides design services rather than manufacturing chips.
It was founded in 2019 in Penang by Fong Swee Kiang (SK Fong, CEO) and Teh Chee Hak (CH Teh, CTO), both former Intel, Altera and Broadcom engineers. The name combines their initials, SK and CH.
Yes. SkyeChip Berhad listed on Bursa Malaysia's Main Market on 20 May 2026, raising RM352 million in the largest Malaysian IPO in 16 years, with a debut market capitalisation of about RM3.97 billion.
Core offerings include memory-interface IP (HBM3E, DDR5/DDR4, LPDDR5/5x PHY and controllers), UCIe 2.0 die-to-die interconnect, network-on-chip fabrics, RISC-V CPU and PLL IP, plus custom ASIC design and NPI/HVM engineering services.
Its customers are chip and system companies building AI, HPC and data-centre silicon. Revenue is concentrated in China (about 56.5% of FY2025 sales) and Taiwan, which together represent over 90% of revenue.
Figures reflect publicly reported data as of mid-2026 and may be approximate. Sources include SkyeChip, The Edge Malaysia, Techwire Asia, The Star and InvestPenang.