# Vinci

> Vinci (Vinci4D, Inc.) is a Palo Alto physics-AI startup building a foundation model that simulates how hardware will behave before it is manufactured. Its system runs full manufacturing-resolution physics - thermal, thermo-mechanical and warpage analysis for advanced semiconductor packaging and 2.5D/3D chips - up to 1,000x faster than traditional finite-element tools, without meshing and without training on customer data. Founded in 2023 by Dr. Hardik Kabaria and Dr. Sarah Osentoski, the company emerged from stealth in December 2025 with $46M in total funding and has been benchmarked by over half of the world's top 20 semiconductor companies.

- **Founded:** 2023
- **Headquarters:** Palo Alto, United States
- **Founders:** Hardik Kabaria (Co-Founder & CEO), Sarah Osentoski (Co-Founder)
- **Team size:** ~25-35 employees
- **Products:** Physics AI Foundation Model, Thermo-Mechanical Simulation, Thermal Analysis, Secure On-Prem / Behind-the-Firewall Deployment
- **Notable:** Emerged from stealth in December 2025 with $46M in total funding., Completed a complex semiconductor packaging configuration in ~30 minutes versus days for traditional approaches., Benchmarked by more than half of the world's top 20 semiconductor companies.

## Products & services

- **Physics AI Foundation Model** — A foundation model that natively understands the governing laws of physical systems, combining AI acceleration with FEA solver accuracy to deliver full manufacturing-resolution simulations - up to 1,000x faster than traditional FEA, without meshing and without training on customer data.
- **Thermo-Mechanical Simulation** — Production-grade thermo-mechanical analysis at manufacturing scale that predicts warpage and thermal stress in advanced semiconductor packages and 2.5D/3D integrated circuits.
- **Thermal Analysis** — High-fidelity thermal conduction simulation answering questions like 'will this device get hot enough to shut down?' on real designs at nanometer resolution in minutes.
- **Secure On-Prem / Behind-the-Firewall Deployment** — Deployment that protects customer IP by running without exposing proprietary geometry, and without per-case retraining or tuning.

## Achievements

- Emerged from stealth in December 2025 with $46M in total funding.
- Completed a complex semiconductor packaging configuration in ~30 minutes versus days for traditional approaches.
- Benchmarked by more than half of the world's top 20 semiconductor companies.
- Shipped production-grade thermo-mechanical (warpage) simulation at manufacturing scale.
- Published advanced semiconductor packaging research at IEEE EPTC 2025.

## Latest updates

- **2026-02** — Shipped production-grade thermo-mechanical simulation that predicts warpage in hardware designs at manufacturing scale.
- **2025-12** — Emerged from stealth and announced $46M in total funding; published advanced packaging research at IEEE EPTC 2025.
- **2025-12** — Series A of $36M led by Xora Innovation, with Khosla Ventures and Eclipse Ventures.

## Links

- Website: https://www.getvinci.ai
- LinkedIn: https://www.linkedin.com/company/vinci4d-ai

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Profile page: https://yespress.io/vinci4d-ai
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Last updated: 2026-06-27