# Thintronics

> Thintronics is a San Francisco-based advanced materials company reinventing the humble insulator - the dielectric films that sit between the copper layers of every chip and circuit board. Founded in 2019 by chemist Stefan Pastine, the company designs new insulating materials from the molecular level up, aiming to deliver faster, lower-loss, lower-power interconnects for AI data centers, high-speed networking, and RF/millimeter-wave systems. Its pitch is pointed: challenge the Japanese incumbent Ajinomoto, which has held more than 90% of the dielectric build-up film market for three decades, with a US-made alternative built for the terabit age.

- **Founded:** 2019
- **Headquarters:** San Francisco, California, United States
- **Founders:** Stefan Pastine (Founder & CEO)
- **Team size:** ~29 employees
- **Products:** Interconnect dielectric platform, Advanced packaging build-up films, High-speed & RF/mmW dielectrics
- **Notable:** Closed a $23M Series A in 2024 led by Maverick Capital and Translink Capital., Added M Ventures (Merck KGaA) and TGVP (Toppan) in a Series A extension, bringing strategic materials investors onto the cap table., Won a US National Science Foundation grant supporting its materials R&D.

## Products & services

- **Interconnect dielectric platform** — A suite of high-performance insulating (dielectric) materials engineered from the molecular level to serve all chip and package layers, with low dielectric constant (Dk) and low loss for cleaner high-speed signaling.
- **Advanced packaging build-up films** — Next-generation build-up film alternative to conventional fiberglass-based insulators, offering roughly 50% thickness reduction and tunable flexible-or-rigid properties for advanced and heterogeneous chip packaging.
- **High-speed & RF/mmW dielectrics** — Dielectric films targeting 224G links and beyond, plus RF and millimeter-wave and 5G/6G wireless applications, focused on signal integrity, power integrity, and thermomechanical reliability.

## Achievements

- Closed a $23M Series A in 2024 led by Maverick Capital and Translink Capital.
- Added M Ventures (Merck KGaA) and TGVP (Toppan) in a Series A extension, bringing strategic materials investors onto the cap table.
- Won a US National Science Foundation grant supporting its materials R&D.
- Built a molecular-design dielectric platform positioned to challenge a 30-year, 90%+ market-share incumbent.
- Developed insulators supporting 224Gbps interconnects with ~50% thickness reduction versus conventional options.

## Latest updates

- **2024-04** — Closed $23M Series A led by Maverick Capital and Translink Capital, with Tallwood participating and an NSF grant.
- **2024-08** — Announced a Series A extension adding M Ventures (Merck KGaA) and TGVP (Toppan Holdings).
- **2024-04** — Profiled by MIT Technology Review as a US startup taking on dielectric-film incumbent Ajinomoto.

## Links

- Website: https://thintronics.com
- LinkedIn: http://www.linkedin.com/company/thintronics

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Profile page: https://yespress.io/thintronics
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Last updated: 2026-07-10