# Syenta

> Syenta is an Australian deep-tech semiconductor company building next-generation chip-to-chip interconnects for the AI era. Spun out of the Australian National University, it has developed a proprietary process called Localized Electrochemical Manufacturing (LEM) that deposits and patterns metal in a single step, producing micron-scale interconnects across large packages with fewer process steps. The technology targets the 'memory wall' that limits AI and high-performance computing, aiming to raise interconnect density and bandwidth while cutting manufacturing cost and waste. Headquartered in Sydney with a new development facility in Tempe, Arizona, Syenta has raised more than A$37 million, with former Intel CEO Pat Gelsinger joining its board.

- **Founded:** 2022
- **Headquarters:** Sydney, Australia
- **Founders:** Dr Jekaterina Viktorova (Co-founder & CEO), Ben Wilkinson (Co-founder & CTO), Professor Luke Connal (Co-founder (Materials Science)), Zachary Dowse (Co-founder & COO)
- **Team size:** ~53 employees
- **Products:** Localized Electrochemical Manufacturing (LEM), High-Resolution Interconnects, Large-package advanced packaging
- **Notable:** Raised more than A$37 million in total funding by 2026, Former Intel CEO Pat Gelsinger joined the board of directors as part of the Series A, Secured A$10.1M from Australia's National Reconstruction Fund to help anchor a domestic semiconductor sector

## Products & services

- **Localized Electrochemical Manufacturing (LEM)** — A proprietary process that combines metal deposition and patterning into a single step using stamp electrodes with dielectric patterns, enabling sub-micron resolution precision metal deposition without traditional etch/resist steps.
- **High-Resolution Interconnects** — Next-generation chip-to-chip connections with micron and sub-micron redistribution layers (RDL) that raise interconnect density and bandwidth for AI and HPC packaging.
- **Large-package advanced packaging** — Interconnect fabrication on packages larger than 1000 mm2 with field sizes of 100-200mm, aimed at high-volume 3D and wafer-level system integration.

## Achievements

- Raised more than A$37 million in total funding by 2026
- Former Intel CEO Pat Gelsinger joined the board of directors as part of the Series A
- Secured A$10.1M from Australia's National Reconstruction Fund to help anchor a domestic semiconductor sector
- Opened first US facility at ASU Research Park in Tempe, Arizona (2026), with plans for ~200 skilled roles
- Selected as a 2025 semi-finalist in the SEMI S3 sustainability program
- Awarded an A$4.8M Industry Growth Program grant
- Demonstrated micron-scale interconnects with ~40% fewer process steps and claimed 3x throughput vs existing fabrication

## Latest updates

- **2026-04** — Raised US$26M Series A led by Playground Global and Australia's NRF (~A$37M total); Pat Gelsinger joined the board.
- **2026-04** — Opened first US facility at ASU Research Park in Tempe, Arizona, planning ~200 highly skilled roles.
- **2025-08** — Raised A$8.8M to tackle AI's memory bandwidth bottleneck with next-gen chip packaging.
- **2025** — Named a semi-finalist in the SEMI S3 program and presented at 3D & Systems Summit, SPIE and IMAPS 2025.

## Links

- Website: https://syenta.com
- LinkedIn: https://www.linkedin.com/company/syenta

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Profile page: https://yespress.io/syenta
Published by YesPress — https://yespress.io
Last updated: 2026-07-25