# SkyeChip

> SkyeChip is a Penang-based fabless semiconductor company that designs silicon intellectual property (IP) and custom application-specific integrated circuits (ASICs) for artificial intelligence and high-performance computing. Founded in 2019 by former Intel, Altera and Broadcom engineers, it specialises in advanced memory-interface IP (HBM3E, DDR5, LPDDR5/5x), UCIe die-to-die interconnect, network-on-chip fabrics and RISC-V CPU IP built on 6nm/7nm process nodes. Recognised as Malaysia's first homegrown AI chip designer, SkyeChip listed on Bursa Malaysia's Main Market in May 2026 in the country's largest IPO in 16 years.

- **Founded:** 2019
- **Headquarters:** Bayan Lepas, Penang, Malaysia
- **Founders:** Fong Swee Kiang (SK Fong) (Co-founder & CEO), Teh Chee Hak (CH Teh) (Co-founder & CTO)
- **Team size:** ~340-365 employees, predominantly experienced IC designers
- **Products:** Memory Interface IP, UCIe Die-to-Die (D2D) Interconnect, Network-on-Chip (NoC), Processor & RISC-V CPU IP, ASIC Design Services
- **Notable:** Recognised as Malaysia's first homegrown AI chip designer, Largest Malaysian IPO in 16 years - RM352 million raised, 95x oversubscribed, Opened at RM3.50 vs 88 sen IPO price; ~RM3.97 billion market cap at debut

## Products & services

- **Memory Interface IP** — PHY and controller IP for HBM3/HBM3E (up to 9600 MT/s), DDR5/DDR4 and LPDDR5/5x, targeting the bandwidth demands of AI and high-performance computing. The company's fastest-growing product line.
- **UCIe Die-to-Die (D2D) Interconnect** — UCIe 2.0-compliant chiplet interconnect PHY and controller for high-bandwidth, low-power multi-die and heterogeneous integration.
- **Network-on-Chip (NoC)** — System-optimised network-on-chip fabric IP for complex SoC and multi-die architectures.
- **Processor & RISC-V CPU IP** — Programmable and processor IP including RISC-V CPU cores and high-speed PLLs, with a roadmap toward Arm-based CPU platforms.
- **ASIC Design Services** — Turnkey custom ASIC development on advanced 6nm/7nm process nodes, spanning architecture, RTL, physical design and silicon validation.
- **NPI Engineering & HVM Enablement** — New product introduction engineering, test and product engineering, and high-volume-manufacturing enablement through global foundry collaboration.

## Achievements

- Recognised as Malaysia's first homegrown AI chip designer
- Largest Malaysian IPO in 16 years - RM352 million raised, 95x oversubscribed
- Opened at RM3.50 vs 88 sen IPO price; ~RM3.97 billion market cap at debut
- Memory-interface IP revenue grew 530% between FY2023 and FY2025
- 113 patents filed as of 31 March 2026
- Selected for Arm Flexible Access under a RM1.1 billion government-backed programme
- Cornerstone backing from EPF, Khazanah Nasional and AIA

## Latest updates

- **2026-05** — Listed on Bursa Malaysia Main Market on 20 May 2026, raising RM352 million in Malaysia's largest IPO in 16 years; stock opened at RM3.50 against the 88 sen offer price.
- **2026-05** — Announced plans to expand into AI silicon products, including custom AI accelerators and Arm-based CPU platforms.
- **2026-03** — Patent count reached 113 filed as of 31 March 2026.
- **2025-07** — Published new benchmark work on high-bandwidth memory IP for next-generation compute (HBM3E up to 9600 MT/s).

## Links

- Website: https://skyechip.com
- LinkedIn: https://www.linkedin.com/company/skyechip

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Profile page: https://yespress.io/skyechip
Published by YesPress — https://yespress.io
Last updated: 2026-07-25