# IceMOS Technology Corporation

> IceMOS designs and manufactures engineered silicon wafers, MEMS substrates and power MOSFETs. Its wafer bonding, deep etching and shaping expertise supports sensing, precision watch components and power conversion. Headquartered in Arizona with manufacturing in Belfast, it raised $22 million in April 2025 to support its mSJMOS power-device platform.

- **Founded:** 2004
- **Headquarters:** Paradise Valley, United States
- **Founders:** Samuel J. Anderson (Founder, President and CEO; described as Chairman in company announcements)
- **Products:** Thick-film SOI wafers, SiSi bonded wafers, Cavity-bonded SOI, Trench-isolated SOI, Through-silicon-via substrates
- **Notable:** 2024 Made in the UK, Sold to the World award, manufacturing category., Company reported 99% of business exported outside the British Isles in 2024., Reported more than 70 company patents in its April 2025 funding announcement.

## Products & services

- **Thick-film SOI wafers** — 100-200 mm silicon-on-insulator wafers customised for MEMS, analog ICs, optoelectronics and precision watch applications.
- **SiSi bonded wafers** — Direct-bonded silicon layers with selectable resistivities and orientations, offered as an alternative to thick epitaxial and inverse-epi substrates.
- **Cavity-bonded SOI** — 100-150 mm wafers with pre-etched features beneath a silicon membrane for pressure sensors, microphones, inertial MEMS and microfluidics.
- **Trench-isolated SOI** — 100-150 mm wafers combining thick-film SOI, deep trench etching and refill for electrical isolation.
- **Through-silicon-via substrates** — Custom, CMOS-compatible substrates with preformed through-wafer interconnects made using etching and doped-polysilicon refill.
- **DSOI and DSP wafers** — Double-SOI structures and double-side-polished wafers for customised device processing.
- **Foundry and inspection services** — Individual wafer-processing steps, DRIE, CAD and process-flow assistance, and nondestructive scanning acoustic microscopy.
- **Superjunction MOSFETs and mSJMOS platform** — Silicon power devices combining MEMS process techniques with superjunction structures; April 2025 funding supported preparations to launch mSJMOS platforms.

## Achievements

- 2024 Made in the UK, Sold to the World award, manufacturing category.
- Company reported 99% of business exported outside the British Isles in 2024.
- Reported more than 70 company patents in its April 2025 funding announcement.
- September 2026 UK semiconductor sector study describes IceMOS as one of the UK’s few dedicated small-volume foundry service providers.

## Latest updates

- **2026-09** — UK government sector study identifies IceMOS’s SOI, high-voltage MOSFET, MEMS and small-volume foundry capabilities.
- **2025-12** — Established IceMOS Technology Hong Kong Limited and opened a Hong Kong Science Park office for sales, applications engineering and supply-chain support.
- **2025-04** — Announced $22 million Series E and appointment of Niall Lyne as COO and EVP, Global Sales; expansion above 100 employees was a plan, not a verified current headcount.

## Links

- Website: https://www.icemostech.com/
- LinkedIn: https://www.linkedin.com/company/icemos-technology-corporation

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Profile page: https://yespress.io/icemos-technology-corporation
Published by YesPress — https://yespress.io
Last updated: 2026-10-16