# Halo Industries, Inc.

> Halo Industries is a Santa Clara deep-tech company that uses lasers instead of diamond wire saws to slice silicon carbide crystal boules into wafers, the foundational substrate for high-voltage power electronics. Spun out of Stanford in 2014, its proprietary light-based process aims to eliminate kerf loss, cut defects, and slash water and energy use, giving more usable wafers from every expensive crystal. Backed by an $80M Series B, Halo is scaling SiC production for electric vehicles, grid infrastructure, renewables, and aerospace, and extending the same approach to silicon, sapphire, and diamond.

- **Founded:** 2014
- **Headquarters:** Santa Clara, California, United States
- **Founders:** Andrei Iancu (Co-founder & CEO), Philip Van Stockum (Co-founder & CTO), Charlie Rudy (Co-founder)
- **Team size:** ~83 employees
- **Products:** Laser SiC Wafering, Laser-Based Processing Tools, Metrology & Wafer Mapping, Multi-Material Wafering
- **Notable:** Closed an oversubscribed $80M Series B in July 2024 led by Thomas Tull's US Innovative Technology Fund, reaching ~$300M valuation., Scaled laser SiC wafer output toward a 24,000-wafers-per-month target from a ~1,000/month baseline., Demonstrated laser SiC wafering with near-zero material loss in a California Energy Commission project.

## Products & services

- **Laser SiC Wafering** — Proprietary multi-step laser process that slices silicon carbide crystal boules into wafers, replacing diamond wire saws to eliminate kerf loss, increase yield, and reduce defects such as wafer bow.
- **Laser-Based Processing Tools** — Hardware systems that substitute light-based steps for mechanical and thermal ones across the wafering workflow, cutting water and energy consumption.
- **Metrology & Wafer Mapping** — Inspection and mapping technology that measures wafer surface quality and defects to drive yield and process control.
- **Multi-Material Wafering** — Application of the same laser approach to silicon, sapphire, diamond, gallium nitride, and lithium tantalate substrates.

## Achievements

- Closed an oversubscribed $80M Series B in July 2024 led by Thomas Tull's US Innovative Technology Fund, reaching ~$300M valuation.
- Scaled laser SiC wafer output toward a 24,000-wafers-per-month target from a ~1,000/month baseline.
- Demonstrated laser SiC wafering with near-zero material loss in a California Energy Commission project.
- Extended its laser wafering process across silicon, sapphire, diamond, gallium nitride, and lithium tantalate.
- Grew from a 2014 Stanford PhD project into an ~83-person advanced-manufacturing company.

## Latest updates

- **2026-03** — Selected Eyelit Technologies' AI-powered composable MES to run and scale its SiC wafering production.
- **2024-07** — Closed an oversubscribed $80M Series B led by US Innovative Technology Fund with 8VC and SAIC.
- **2024-06** — California Energy Commission published results of Halo's laser-based SiC wafer manufacturing project.

## Links

- Website: https://halo-industries.com
- LinkedIn: https://www.linkedin.com/company/halo-industries/

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Last updated: 2026-07-11