# Global Unichip Corporation (GUC)

> Global Unichip Corporation (GUC) is a Taiwan-based, TSMC-affiliated ASIC design and manufacturing services company that turns a customer's chip idea into a finished, shippable part. Working in TSMC's most advanced process nodes and packaging technologies - CoWoS, InFO, SoIC and System-on-Wafer - GUC designs, verifies, packages and manufactures custom silicon for the AI, high-performance computing, networking, automotive and storage markets, and supplies the die-to-die, UCIe, GLink and HBM interconnect IP that stitches modern multi-die chips together.

- **Founded:** 1998
- **Headquarters:** Hsinchu, Taiwan
- **Team size:** ~890 employees
- **Products:** ASIC Design Service, Turnkey Manufacturing, 2.5D/3D Advanced Packaging (APT Platform), Silicon-Verified IP Portfolio, Multi-Project Wafer (MPW) Service
- **Notable:** Broke NT$30 billion in annual revenue for the first time in 2025, reaching NT$34.14 billion (~US$1.09B)., Grew turnkey manufacturing to over 80% of total revenue., Reserved 60,000 CoWoS wafers with TSMC for 2027 to meet cloud-service-provider demand.

## Products & services

- **ASIC Design Service** — End-to-end custom chip development covering front-end/spec-in design, SoC integration, physical implementation, and design verification.
- **Turnkey Manufacturing** — Full production service from wafer to packaged, tested part - now over 80% of GUC's revenue.
- **2.5D/3D Advanced Packaging (APT Platform)** — Design and manufacturing for TSMC's CoWoS, InFO, SoIC and System-on-Wafer packaging, including SI/PI co-simulation, for multi-die AI/HPC chips.
- **Silicon-Verified IP Portfolio** — UCIe die-to-die IP (32G/36G/64G), GLink-2.5D/GLink-3D custom interconnect, HBM high-bandwidth memory interface, and high-speed SerDes IP.
- **Multi-Project Wafer (MPW) Service** — Shared-wafer prototyping that lets customers tape out designs without funding a full mask set.

## Achievements

- Broke NT$30 billion in annual revenue for the first time in 2025, reaching NT$34.14 billion (~US$1.09B).
- Grew turnkey manufacturing to over 80% of total revenue.
- Reserved 60,000 CoWoS wafers with TSMC for 2027 to meet cloud-service-provider demand.
- Taped out industry-leading UCIe face-up IP for TSMC SoIC-X and a 40Gbps UCIe IP using adaptive voltage.
- Achieved 40 Tbps/mm2 with custom GLink-3D 2.0 die-on-die interconnect through a lead customer.
- Joined both the Arm Total Design and NVIDIA NVLink Fusion ecosystems within a year.

## Latest updates

- **2026-07** — Reported a new all-time monthly revenue record, with turnkey manufacturing surpassing 80% of revenue.
- **2026-02** — Posted record full-year 2025 revenue and profit and proposed an NT$20 cash dividend per share.
- **2025-10** — Joined the NVIDIA NVLink Fusion ecosystem and spoke on co-packaged optics at the 2025 OCP Global Summit.
- **2025-09** — Launched its next-generation 2.5D/3D APT platform leveraging TSMC's latest 3DFabric and advanced process technologies.
- **2025-01** — Taped out a UCIe 40Gbps IP using adaptive voltage and industry-leading UCIe face-up IP for TSMC SoIC-X.
- **2024-12** — Joined the Arm Total Design ecosystem to strengthen its ASIC design offerings.

## Links

- Website: https://guc-asic.com
- LinkedIn: https://www.linkedin.com/company/guc
- Facebook: https://facebook.com/guc.taiwan

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Profile page: https://yespress.io/guc
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Last updated: 2026-08-13