# GlobalFoundries

> GlobalFoundries is a contract semiconductor manufacturer that combines process technology, chip-design support, intellectual property and high-volume fabrication for more than 200 customers. Instead of competing primarily to make the smallest leading-edge logic, it concentrates on feature-rich chips for radio frequency, power management, automotive systems, connected devices, silicon photonics, aerospace and defense, and emerging physical-AI and quantum applications.

- **Founded:** 2009
- **Headquarters:** Malta, New York, United States
- **Founders:** Advanced Micro Devices (AMD) (Co-founder through manufacturing-business divestiture), Advanced Technology Investment Company (Mubadala) (Co-founder and investment partner)
- **Team size:** More than 13,000 employees
- **Products:** FDX FD-SOI, FinFET, RF platforms, Power technologies, Silicon photonics
- **Notable:** Built a scaled manufacturing footprint across the United States, Germany and Singapore through the combination of AMD, Chartered Semiconductor and IBM microelectronics assets., Completed a Nasdaq initial public offering in 2021 at $47 per share., Serves more than 200 global customers through purpose-built specialty semiconductor platforms.

## Products & services

- **FDX FD-SOI** — 22nm fully depleted silicon-on-insulator platforms for energy-efficient, adaptive edge computing, RF and automotive applications.
- **FinFET** — 12nm-class FinFET processes for performance-sensitive compute, networking and edge-AI designs.
- **RF platforms** — RF-SOI, silicon germanium and RF GaN technologies for mobile front ends, radar, wireless infrastructure and aerospace systems.
- **Power technologies** — BCD and gallium-nitride platforms for efficient power conversion, management and delivery.
- **Silicon photonics** — Production platforms integrating photonics, RF and packaging for optical transceivers and co-packaged optics.
- **Advanced packaging** — 2.5D and 3D integration, wafer-to-wafer and die-to-wafer bonding, and interposer-based architectures.
- **MIPS and ARC processor IP** — RISC-V and ARC processor cores, software tools and custom design capabilities that extend GF from process technology toward software-to-silicon delivery; MIPS was acquired in 2025 and the ARC business in 2026.
- **Quantum Technology Solutions** — Cryogenic CMOS, materials, packaging and scaled manufacturing services for quantum-computing developers.
- **GlobalShuttle MPW and design enablement** — Multi-project wafer access, process design kits, IP libraries, engineering support and partner services that help customers move designs into silicon.

## Achievements

- Built a scaled manufacturing footprint across the United States, Germany and Singapore through the combination of AMD, Chartered Semiconductor and IBM microelectronics assets.
- Completed a Nasdaq initial public offering in 2021 at $47 per share.
- Serves more than 200 global customers through purpose-built specialty semiconductor platforms.
- Received a final U.S. CHIPS award of up to $1.5 billion in 2024 for New York and Vermont projects.
- Announced $16 billion of planned U.S. manufacturing, advanced-packaging and R&D investment in 2025.
- Expanded into processor IP by completing acquisitions of MIPS and Synopsys’ ARC Processor IP Solutions business.
- Launched Quantum Technology Solutions and the SCALE co-packaged-optics module in 2026.
- Paid its first quarterly cash dividend in July 2026.
- Shipped 625,000 300mm-equivalent wafers in Q2 2026, up 8 percent year over year.

## Latest updates

- **2026-08** — Reported Q2 revenue of $1.786 billion, 625,000 300mm-equivalent wafer shipments and a 28.3 percent IFRS gross margin.
- **2026-07** — Signed a letter of intent for an expected $300 million U.S. CHIPS R&D award for silicon photonics, new optical materials and advanced packaging.
- **2026-07** — Completed the acquisition of Photeon Technologies’ integrated-voltage-regulator business for AI data-center power delivery.
- **2026-06** — Completed the acquisition of Synopsys’ ARC Processor IP Solutions business.
- **2026-06** — Qualified SLATE wafer-to-wafer bonding on the 9SW RF-SOI platform, with volume production expected in the second half of 2027.
- **2026-05** — Launched Quantum Technology Solutions and introduced the SCALE optical-module solution for co-packaged optics.
- **2026-05** — Announced its first quarterly dividend and a capital-return framework targeting up to half of trailing non-IFRS adjusted free cash flow after investments.

## Links

- Website: https://gf.com/
- LinkedIn: https://www.linkedin.com/company/globalfoundries
- Twitter/X: https://x.com/GLOBALFOUNDRIES
- YouTube: https://www.youtube.com/@globalfoundries
- Instagram: https://www.instagram.com/globalfoundries.corporate/
- Facebook: https://www.facebook.com/GlobalFoundries/

---

Profile page: https://yespress.io/globalfoundries
Published by YesPress — https://yespress.io
Last updated: 2026-08-13