# Frore Systems

> Frore Systems is a Silicon Valley thermal-technology company that builds AirJet, the world's first solid-state active cooling chip, and LiquidJet, a direct-liquid coldplate for AI data centers. Founded in 2018 by two former Qualcomm engineers, Frore uses ultrasonic membranes to move air at over 100 mph with no visible moving parts, letting thin fanless devices and dense AI servers run cooler, quieter, and faster. In March 2026 it raised a $143M Series D at a $1.64B valuation, positioning its 'Thermal Stack' as foundational infrastructure for the AI era.

- **Founded:** 2018
- **Headquarters:** San Jose, California, United States
- **Founders:** Seshu Madhavapeddy (Founder & CEO), Surya Ganti (Founder & CTO)
- **Team size:** ~91 employees
- **Products:** AirJet Mini / Mini G2, AirJet Pro / PAK, LiquidJet, LiquidJet Nexus
- **Notable:** Achieved unicorn status at a $1.64B valuation with its March 2026 Series D, Raised $340M in total funding across four rounds, Shipped the world's first solid-state active cooling chip (AirJet)

## Products & services

- **AirJet Mini / Mini G2** — The world's first solid-state active cooling chip. Uses ultrasonic membranes to move air over 100 mph with no visible moving parts; the Mini G2 removes 7.5W of heat, 50% more than the original, for laptops, tablets, smartphones, mini PCs and SSDs.
- **AirJet Pro / PAK** — Higher-capacity solid-state cooling modules and packaged edge-AI cooling solutions (including AirJet PAK 5C-G2) for sustained performance in fanless and edge-AI systems.
- **LiquidJet** — A 3D short-loop jet-channel multi-stage direct-liquid coldplate for data-center GPUs, claimed to deliver 75% higher heat-transfer efficiency, 8C cooler GPUs, ~4% more AI tokens per second and 55% lighter coldplates.
- **LiquidJet Nexus** — An integrated liquid-cooling system for NVIDIA Kyber half-U compute trays, targeting 2x compute density per rack and support for 53C inlet temperatures.

## Achievements

- Achieved unicorn status at a $1.64B valuation with its March 2026 Series D
- Raised $340M in total funding across four rounds
- Shipped the world's first solid-state active cooling chip (AirJet)
- Won CES Innovation Awards three years running for AirJet
- Design wins in Qualcomm Snapdragon X2 Elite reference notebooks and Mini PCs
- Enabled AT&T's Sonim MegaConnect, the first ultra-compact Power Class 1 5G hotspot on FirstNet

## Latest updates

- **2026-03** — Closed $143M Series D led by MVP Ventures at a $1.64B valuation, reaching unicorn status; total raised now $340M.
- **2026-01** — AirJet Mini G2 earns a third consecutive CES Innovation Award and is showcased in Qualcomm Snapdragon X2 Elite reference designs.
- **2025** — Introduced LiquidJet and LiquidJet Nexus, extending the 'Thermal Stack' from edge devices into AI data centers.
- **2024-05** — Raised $80M Series C led by Fidelity, bringing total funding to $196M.

## Links

- Website: https://froresystems.com
- LinkedIn: https://www.linkedin.com/company/froresystems
- Twitter/X: https://twitter.com/FroreSystems
- YouTube: https://www.youtube.com/@froresystems
- Facebook: https://www.facebook.com/FroreSystems

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Profile page: https://yespress.io/frore-systems
Published by YesPress — https://yespress.io
Last updated: 2026-07-11