# Ferric, Inc.

> Ferric, Inc. is a New York semiconductor company that builds integrated voltage regulators (IVRs) - complete DC-DC power converters with thin-film magnetic inductors built directly into the chip. By shrinking power conversion down to silicon that can sit inside a processor package, Ferric cuts board space and bill-of-materials while improving energy efficiency, targeting the punishing power demands of AI accelerators, high-performance computing, and hyperscale data centers.

- **Founded:** 2012
- **Headquarters:** New York, United States
- **Founders:** Noah Sturcken (Co-Founder & CEO), Kenneth Shepard (Co-Founder, Chairman & Technical Advisor)
- **Team size:** ~49 employees
- **Products:** Fe1766, Fe1736, Fe1728, CMOS-integrated thin-film magnetics
- **Notable:** Developed CMOS-integrated thin-film magnetic inductors backed by 40+ patents over a decade of research., Fe1766 delivers 160A at 4.5 A/mm current density and ~93% efficiency., Technology proven in shipping products since 2021.

## Products & services

- **Fe1766** — Flagship integrated voltage regulator delivering 160A from 35.5 mm of silicon (4.2 x 8 x 1 mm), with industry-leading 4.5 A/mm current density, ~93% efficiency, and a fully integrated inductor small enough to sit within the processor package.
- **Fe1736** — 16-phase buck converter delivering 56A in roughly 20 mm, aimed at dense board-level power delivery.
- **Fe1728** — Flexible 8-phase converter supporting up to 4 independent outputs for multi-rail power needs.
- **CMOS-integrated thin-film magnetics** — Proprietary thin-film ferromagnetic inductor technology integrated in CMOS, reportedly ~10x smaller than conventional inductors, the core IP behind every Ferric IVR.

## Achievements

- Developed CMOS-integrated thin-film magnetic inductors backed by 40+ patents over a decade of research.
- Fe1766 delivers 160A at 4.5 A/mm current density and ~93% efficiency.
- Technology proven in shipping products since 2021.
- Spun out of Columbia University; recognized via Blavatnik Awards honoree lineage.
- Technology moving to volume production with TSMC.

## Latest updates

- **2026-02** — Latest funding raise recorded (Series B stage).
- **2025-08** — Launched the Fe1766 IVR - 160A from 35.5 mm of silicon for AI and high-performance processors.
- **2025-06** — Announced collaboration with Marvell to advance integrated voltage regulation for AI and cloud infrastructure.
- **2024-11** — Closed Series B funding round.

## Links

- Website: https://www.ferric.com
- LinkedIn: https://www.linkedin.com/company/ferric

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Profile page: https://yespress.io/ferric-inc
Published by YesPress — https://yespress.io
Last updated: 2026-06-07