# ESWIN Computing

> ESWIN Computing is a Beijing-based chip company building system-on-chip products around the open RISC-V architecture. It designs edge-computing and AI SoCs - most notably the EIC77 series - pairs them with its own NPU and software stack, and sells them as chips and developer boards for smart home, automotive, industrial, and PC-class computing. It is the IC-and-solutions arm of the larger Beijing ESWIN Technology Group founded by former BOE chairman Wang Dongsheng.

- **Founded:** 2016
- **Headquarters:** Beijing, China
- **Founders:** Wang Dongsheng (Founder & Chairman, ESWIN Technology Group), Bo Wang (Vice Chairman, ESWIN Computing)
- **Team size:** ~4,000 employees (ESWIN Technology Group)
- **Products:** EIC7700 / EIC7700X SoC, EIC7702 / EIC7702X SoC, EBC7700 SBC (EBC77 series), HiFive Premier P550 (SoC supplier), RISAA software platform
- **Notable:** Designed the EIC7700X SoC that powers the HiFive Premier P550, described as the first commercially available out-of-order RISC-V development board., Raised ~$421M in a 2023 Series D to fund RISC-V R&D., Premier member of RISC-V International.

## Products & services

- **EIC7700 / EIC7700X SoC** — Single-die RISC-V edge-computing SoC with four 64-bit RV64GC cores up to 1.8 GHz and a built-in DNN/NPU delivering 13.3 TOPS (int8) for AI vision workloads.
- **EIC7702 / EIC7702X SoC** — Dual-die RISC-V AI-PC class SoC, the higher-performance members of the EIC77 family aimed at PC and higher-compute applications.
- **EBC7700 SBC (EBC77 series)** — RISC-V single-board computer powered by the EIC7700/EIC7700X SoC, sold to developers and available online.
- **HiFive Premier P550 (SoC supplier)** — ESWIN-designed EIC7700X SoC powers SiFive's HiFive Premier P550, the first commercially available out-of-order RISC-V development board, running Ubuntu.
- **RISAA software platform** — ESWIN's basic and tool software stack plus domain-specific software solutions supporting its RISC-V silicon.
- **RISC-V IP modules** — Proprietary RISC-V cores and domain-specific IP modules offered as part of an IC-and-solutions portfolio.

## Achievements

- Designed the EIC7700X SoC that powers the HiFive Premier P550, described as the first commercially available out-of-order RISC-V development board.
- Raised ~$421M in a 2023 Series D to fund RISC-V R&D.
- Premier member of RISC-V International.
- Delivered a RISC-V edge SoC combining SiFive CPU, Imagination GPU and ESWIN's in-house NPU.
- Parent group's silicon-materials arm completed one of China's largest 2025 STAR Market IPOs.

## Latest updates

- **2026-06** — Participated in the RISC-V Europe Summit, presenting its edge-computing roadmap.
- **2026-04** — Showcased vehicle chip solutions at the Beijing Auto Show and joined SAC/TC599 RISC-V standards work.
- **2025-10** — Parent group's Xi'an ESWIN Material Technology listed on Shanghai's STAR Market, closing up ~199% on debut at a ~$14.6B valuation.
- **2024** — Unveiled the EIC77 SoC series (EIC7700/7700X, EIC7702/7702X) for edge computing and RISC-V AI PC.

## Links

- Website: https://eswincomputing.com
- LinkedIn: http://www.linkedin.com/company/eswincomputing
- GitHub: https://github.com/eswincomputing

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Last updated: 2026-07-12