# DEEPX

> DEEPX is a South Korean fabless semiconductor startup building ultra-low-power neural processing units (NPUs) for on-device and edge AI. Founded in 2018 by former Apple chip designer Lokwon Kim, the company designs AI accelerators - led by its 25 TOPS DX-M1 chip - that run vision and generative AI models at under 5 watts, aiming to move intelligence out of the data center and into robots, cameras, factories, mobility and everyday devices. It raised an $80.5M Series C in 2024 at a $529M valuation and positions itself as a 'Physical AI infrastructure company.'

- **Founded:** 2018
- **Headquarters:** Seongnam-si, Gyeonggi-do, South Korea
- **Founders:** Lokwon Kim (Founder & CEO)
- **Team size:** ~110-117 employees
- **Products:** DX-M1, DX-M1M, DX-V1 / DX-V3, DX-H1, DXNN SDK
- **Notable:** $80.5M Series C at a $529M valuation (2024), backed by Korean semiconductor industry leaders., First AI semiconductor company to win a CES 'triple crown' - robotics, embedded technology and hardware components awards (CES 2024)., Two CES 2026 Innovation Awards; DX-M1 powered Sixfab's ALPON X5, which took CES's top 'Best of Innovation' honor.

## Products & services

- **DX-M1** — First-generation 5nm AI edge processor delivering up to 25 TOPS (INT8) at 2-5W; available as an M.2 accelerator module compatible with Raspberry Pi 5 and x86/ARM hosts.
- **DX-M1M** — Compact variant of the DX-M1 module for space-constrained edge devices.
- **DX-V1 / DX-V3** — AI enabler chips for vision systems in home appliances, surveillance cameras, robot vision and drones.
- **DX-H1** — High-performance AI computing card ('Green AI') for AI boxes, servers and smart factories.
- **DXNN SDK** — Software development kit supporting PyTorch, ONNX and TensorFlow for model compilation and deployment to DEEPX NPUs.
- **Project LAIN** — Second-generation generative-AI NPU designed to run large language models on-device under 5W (in development).

## Achievements

- $80.5M Series C at a $529M valuation (2024), backed by Korean semiconductor industry leaders.
- First AI semiconductor company to win a CES 'triple crown' - robotics, embedded technology and hardware components awards (CES 2024).
- Two CES 2026 Innovation Awards; DX-M1 powered Sixfab's ALPON X5, which took CES's top 'Best of Innovation' honor.
- Named a 'Must-See Company' by the CTA at CES 2025.
- Chips validated by 300+ companies ahead of 5nm mass production.
- 400+ patents filed and 130+ granted worldwide.
- Signed a 2nm sample-chip contract in 2025.

## Latest updates

- **2026-01** — DEEPX rebrands at CES 2026 as a 'Physical AI infrastructure company' and wins two CES 2026 Innovation Awards.
- **2025-11** — DX-M1 powers Sixfab's ALPON X5, which wins CES 2026 'Best of Innovation.'
- **2025-08** — Reports of a planned 2027 IPO; Morgan Stanley reportedly hired for a fundraising round.
- **2025** — 5nm mass production begins; global distributor agreements signed; 2nm sample-chip contract inked.
- **2024-05** — Closes $80.5M Series C at a $529M valuation.

## Links

- Website: https://deepx.ai
- LinkedIn: https://www.linkedin.com/company/deepx-corp/
- YouTube: https://www.youtube.com/@DEEPX_AI

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Profile page: https://yespress.io/deepx
Published by YesPress — https://yespress.io
Last updated: 2026-07-12