# Bo Wang

> Bo Wang is the co-founder, executive director and vice chairman of Beijing ESWIN Computing Technology, where he helps shape strategy and international expansion around RISC-V chips and intelligent systems. After nearly 24 years at Intel, ending as a product director, he joined ESWIN Computing at its 2019 launch, moved from chief operating officer to president and CEO, and later became vice chairman. His public case for RISC-V links open architecture, domain-specific acceleration and ecosystem building to practical products for edge computing, AI PCs, smart devices, vehicles and robotics.

- **Role:** Co-founder, Executive Director and Vice Chairman at ESWIN Computing
- **Organizations:** ESWIN Computing, Intel Corporation, Northeast Electric Power University, California State University, Chico
- **Education:** Bachelor's degree in automation engineering, correspondence education, Northeast Electric Power University, Master's degree in electronic engineering, California State University, Chico
- **Known for:** Built approximately 30 years of integrated-circuit industry experience, including nearly 24 years at Intel., Rose to product director at Intel before leaving in August 2019., Co-founded ESWIN Computing and served successively as COO, president and CEO before becoming vice chairman.

## Career timeline

- **1988** — Completed a bachelor's degree in automation engineering through correspondence education at Northeast Electric Power University.
- **1995** — Earned a master's degree in electronic engineering from California State University, Chico.
- **1995-2019** — Worked at Intel Corporation across R&D, product management, marketing and sales; his final role was product director.
- **2019-09** — Joined ESWIN Computing at its launch as chief operating officer and became a co-founder.
- **2022-05** — Became president and a director of ESWIN Computing.
- **2023-05** — Became chief executive officer of ESWIN Computing.
- **2023-12** — Became vice chairman of ESWIN Computing's board.
- **2024-06** — Presented ESWIN's EIC7700X and EIC7702X computing solutions and a lightning talk on RISC-V innovation at RISC-V Summit Europe in Munich.
- **2025-04** — Was redesignated as an executive director and vice chairman of the Strategy and Investment Committee.
- **2026-01** — Named in ESWIN Computing's renewed Hong Kong listing materials as executive director and vice chairman of the board.

## Achievements

- Built approximately 30 years of integrated-circuit industry experience, including nearly 24 years at Intel.
- Rose to product director at Intel before leaving in August 2019.
- Co-founded ESWIN Computing and served successively as COO, president and CEO before becoming vice chairman.
- Helped drive ESWIN Computing's international market expansion and strategic planning.
- Presented ESWIN's RISC-V edge-computing products at RISC-V Summit Europe 2024.
- Helped frame ESWIN's product approach around RISC-V CPUs, domain-specific acceleration, software and ecosystem partnerships.

## Latest updates

- **2026-01** — ESWIN Computing's renewed Hong Kong listing materials identified Wang as co-founder, executive director and vice chairman, with responsibility for international market expansion and support for strategic planning.
- **2025-04** — Wang was redesignated as an executive director and vice chairman of ESWIN Computing's Strategy and Investment Committee.
- **2024-06** — Wang spoke at RISC-V Summit Europe in Munich about ESWIN's EIC77-series computing solutions and RISC-V innovation.

## Links

- Website: https://www.eswincomputing.com/en/about.html
- LinkedIn: https://www.linkedin.com/in/bo-wang-21bb75304

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Profile page: https://yespress.io/bo-wang
Published by YesPress — https://yespress.io
Last updated: 2026-08-18