# Amkor Technology, Inc.

> Amkor Technology is a global provider of outsourced semiconductor packaging and test services. It connects, protects and tests chips for customers including Apple and Qualcomm, with technologies spanning wirebond packages, wafer-level processing and multi-die integration. Its planned Arizona campus and partnerships with TSMC and NVIDIA put it at the intersection of advanced computing and domestic semiconductor manufacturing.

- **Founded:** 1968
- **Headquarters:** Tempe, United States
- **Founders:** James J. Kim (Founder; Chairman Emeritus)
- **Products:** S-Connect, S-SWIFT, System in Package (SiP), Wafer-level processing and packaging, Flip chip and laminate packages
- **Notable:** Founded in 1968; became publicly listed in 1998., Reported $6.71 billion in 2025 net sales., Reported $1.90 billion in second-quarter 2026 net sales, up 26% year over year.

## Products & services

- **S-Connect** — Embedded silicon bridge technology for high-bandwidth connections between dies in a multi-die package.
- **S-SWIFT** — High-density fan-out integration on a substrate, supporting chiplets and memory with short die-to-die connections.
- **System in Package (SiP)** — Integration of multiple components and functions into a compact module.
- **Wafer-level processing and packaging** — Wafer bumping, wafer-level chip-scale packages and fan-out packaging.
- **Flip chip and laminate packages** — Flip-chip CSP and BGA packaging for mobile, networking, computing and other applications.
- **Mainstream and power packaging** — Wirebond and power-device package families for varied semiconductor applications.
- **Test and engineering services** — Wafer probe, final test, system-level test, burn-in, package design and characterization.

## Achievements

- Founded in 1968; became publicly listed in 1998.
- Reported $6.71 billion in 2025 net sales.
- Reported $1.90 billion in second-quarter 2026 net sales, up 26% year over year.
- Arizona campus broke ground in October 2025.

## Latest updates

- **2026-10** — October 21: announced an additional $1.3 billion NVIDIA agreement supporting South Korean expansion; reported total multi-year NVIDIA agreements of $3 billion.
- **2026-09** — September 8: expanded planned Arizona campus investment to approximately $12 billion with a second phase; phase 2 completion targeted for end-2029.
- **2026-07** — July 27: reported $1.898 billion Q2 revenue and $174 million net income.
- **2026-06** — June 16: announced a ten-year advanced-packaging partnership agreement with TSMC.

## Links

- Website: https://amkor.com/
- LinkedIn: https://www.linkedin.com/company/amkor-technology/
- Twitter/X: https://x.com/AmkorTechnology
- YouTube: https://www.youtube.com/@AmkorTechnology
- Instagram: https://www.instagram.com/amkor_technology_korea/
- Facebook: https://www.facebook.com/AmkorTechnology/

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Profile page: https://yespress.io/amkor-technology-inc
Published by YesPress — https://yespress.io
Last updated: 2026-10-22