# 3D Glass Solutions, Inc.

> 3D Glass Solutions (3DGS) is an Albuquerque, New Mexico advanced-packaging company that turns its patented photosensitive APEX glass-ceramic into precise 3D microstructures for chips. Its wafer-level glass substrates, interposers and integrated passive devices serve RF, photonics, high-performance computing and defense customers who need low-loss, high-frequency, thermally stable packaging. Spun out of technology developed at Sandia National Laboratories and led by semiconductor veteran Babu Mandava, the ISO 9001 / AS9100 certified foundry has raised more than $54 million, counts Intel Capital, Applied Ventures and Lockheed Martin Ventures among its backers, and is a partner in DARPA's Next-Generation Microelectronics Manufacturing (NGMM) program for U.S.-based 3D heterogeneous integration.

- **Founded:** 2005
- **Headquarters:** Albuquerque, New Mexico, United States
- **Founders:** Jeb H. Flemming (Founder & CTO)
- **Team size:** ~66 employees
- **Products:** APEX Glass Technology, Glass Substrates & Interposers, 3D Integrated Passive Devices (IPDs), 3DHI Foundry Services, Design & Assembly Enablement
- **Notable:** Developed and patented APEX photosensitive glass-ceramic enabling micro-fracture-free through-glass vias, ISO 9001 and AS9100 certified glass foundry in Albuquerque, New Mexico, Closed $30M Series C in 2023 led by Walden Catalyst Ventures; over $54M raised total

## Products & services

- **APEX Glass Technology** — Patented photosensitive glass-ceramic material that converts UV-patterned regions to ceramic, then etches them to form micro-fracture-free 3D microstructures and through-glass vias at wafer scale.
- **Glass Substrates & Interposers** — Low-loss glass core substrates and interposers with high interconnect density, fine-pitch redistribution and thermal/dimensional stability for RF, HPC, AI and photonic systems.
- **3D Integrated Passive Devices (IPDs)** — Wafer-level RF passives and filters with high Q factor for frequencies up to and beyond 20 GHz, shrinking RF chip size while improving performance.
- **3DHI Foundry Services** — 3D heterogeneous integration foundry services - multi-layer glass stacking and chiplet integration for commercial, defense, academic and government customers.
- **Design & Assembly Enablement** — Process design kits (PDK) and assembly design kits (ADK) that let customers design and qualify products on the APEX glass platform.

## Achievements

- Developed and patented APEX photosensitive glass-ceramic enabling micro-fracture-free through-glass vias
- ISO 9001 and AS9100 certified glass foundry in Albuquerque, New Mexico
- Closed $30M Series C in 2023 led by Walden Catalyst Ventures; over $54M raised total
- Selected as a partner in DARPA's Next-Generation Microelectronics Manufacturing (NGMM) program
- Demonstrated 66% RF chip size reduction and 2.2x more parts per wafer versus alternatives

## Latest updates

- **2024-09** — Participating as a named partner in DARPA's NGMM program for U.S.-based 3D heterogeneous integration, with Phase 1 kickoff in Austin.
- **2023-04** — Closed $30M Series C led by Walden Catalyst Ventures with Intel Capital, Lockheed Martin Ventures, Applied Ventures, Cambium Capital and Mesh Cooperative Ventures.

## Links

- Website: https://www.3dgsinc.com
- LinkedIn: https://www.linkedin.com/company/3dgsinc

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Last updated: 2026-07-14